Tilo Meister

Group Leader

Dr.-Ing. Tilo Meister

Beyond Moore Circuit Design & mm-Wave IC Design

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Barkhausenbau, Room: 132 Helmholtzstraße 18

01069 Dresden

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List of scientific publications with PDFs

Praktikum Schaltungstechnik Versuch ST1: Verstärkergrundschaltungen

56 Entries

A 2.62 MHz 762 μw cascode amplifier in flexible a-IGZO thin-film technology for textile and wearable-electronics applicationsShabanpour, R., Ishida, K., Perumal, C., Boroujeni, B., Meister, T., Carta, C., Ellinger, F. & 4 others, Sep 2013, International Semiconductor Conference Dresden - Grenoble (ISCDG) 2013. Institute of Electrical and Electronics Engineers (IEEE), 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
Overview of the EC project FLEXIBILITY: Organic and thin-film ICs up to radio frequencies for multifunctional flexible systemsCarta, C., Ishida, K., Boroujeni, B., Shabanpour, R., Meister, T., Schmidt, G., Suomalainen, E. & 12 others, Aug 2013, SBMO/IEEE MTT-S International Microwave & Optoelectronics Conference (IMOC) 2013. 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution

Interface optimization for improved routability in chip-package-board co-designMeister, T., Lienig, J. & Thomke, G., Jun 2011, International Workshop on System Level Interconnect Prediction (SLIP) 2011. 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution

Universal methodology to handle differential pairs during pin assignmentMeister, T., Lienig, J. & Thomke, G., 2010, IFIP Advances in Information and Communication Technology: VLSI-SoC: Design Methodologies for SoC and SiP. Piguet, C., Reis, R. & Soudris, D. (eds.). Springer, Berlin, Heidelberg, Vol. 313. p. 22-42Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report

From 3D circuit technologies and data structures to interconnect predictionFischbach, R., Lienig, J. & Meister, T., Jul 2009, 11th International Workshop on System Level Interconnect Prediction (SLIP) 2009. p. 77-84, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution

Novel pin assignment algorithms for components with very high pin countsMeister, T., Lienig, J. & Thomke, G., Mar 2008, Design, Automation and Test in Europe (DATE) 2008. p. 837-842, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution